Commonly used for bottom discharge of reactors, storage tanks and other containers, connect the bottom flange of the valve to the bottom flange of the storage tank or container. The bottom of the valve is designed to be flat-bottomed, the valve body has a V-shaped structure, and provides two working methods of lifting and lowering valve flaps, namely, upward expansion type discharge and downward expansion type discharge. Pressure range: PN6~PN100/150LB~600LB size range: DN15 ~ DN500 Connection type: welding, flange Temperature range: -29 ° C ~600°C Leakage detection level: zero leakage Application media: wetting agent, asphalt, catalyst, plastic particles, resin sludge, pulp, etc.

| Discharge valve parameter list | |||||||||
| PN25 | DN | H | Do | f | C | d | K | D | n-φb |
| 50 | 480 | 200 | 2 | 20 | 102 | 125 | 165 | 4-φ22 | |
| 65 | 520 | 250 | 2 | 22 | 122 | 145 | 185 | 8-φ18 | |
| 80 | 580 | 250 | 2 | 24 | 138 | 160 | 200 | 8-φ18 | |
| 100 | 620 | 320 | 2 | 24 | 162 | 190 | 235 | 8-φ22 | |
| 125 | 660 | 400 | 2 | 26 | 188 | 220 | 270 | 8-φ26 | |
| 150 | 690 | 400 | 2 | 28 | 218 | 250 | 300 | 8-φ26 | |
| 200 | 720 | 500 | 2 | 30 | 278 | 310 | 360 | 12-φ26 | |
| PN40 | DN | H | Do | f | C | d | K | D | n-φb |
| 50 | 480 | 200 | 2 | 20 | 102 | 125 | 165 | 4-φ22 | |
| 65 | 520 | 250 | 2 | 22 | 122 | 145 | 185 | 8-φ18 | |
| 80 | 580 | 250 | 2 | 24 | 138 | 160 | 200 | 8-φ18 | |
| 100 | 620 | 320 | 2 | 24 | 162 | 190 | 235 | 8-φ22 | |
| 125 | 660 | 400 | 2 | 26 | 188 | 220 | 270 | 8-φ26 | |
| 150 | 690 | 400 | 2 | 28 | 218 | 250 | 300 | 8-φ26 | |
| 200 | 720 | 500 | 2 | 34 | 285 | 320 | 375 | 12-φ30 | |

| Discharge valve parameter list | |||||||||
| PN25 | DN | H | Do | f | C | d | K | D | n-φb |
| 50 | 480 | 200 | 2 | 20 | 102 | 125 | 165 | 4-φ22 | |
| 65 | 520 | 250 | 2 | 22 | 122 | 145 | 185 | 8-φ18 | |
| 80 | 580 | 250 | 2 | 24 | 138 | 160 | 200 | 8-φ18 | |
| 100 | 620 | 320 | 2 | 24 | 162 | 190 | 235 | 8-φ22 | |
| 125 | 660 | 400 | 2 | 26 | 188 | 220 | 270 | 8-φ26 | |
| 150 | 690 | 400 | 2 | 28 | 218 | 250 | 300 | 8-φ26 | |
| 200 | 720 | 500 | 2 | 30 | 278 | 310 | 360 | 12-φ26 | |
| PN40 | DN | H | Do | f | C | d | K | D | n-φb |
| 50 | 480 | 200 | 2 | 20 | 102 | 125 | 165 | 4-φ22 | |
| 65 | 520 | 250 | 2 | 22 | 122 | 145 | 185 | 8-φ18 | |
| 80 | 580 | 250 | 2 | 24 | 138 | 160 | 200 | 8-φ18 | |
| 100 | 620 | 320 | 2 | 24 | 162 | 190 | 235 | 8-φ22 | |
| 125 | 660 | 400 | 2 | 26 | 188 | 220 | 270 | 8-φ26 | |
| 150 | 690 | 400 | 2 | 28 | 218 | 250 | 300 | 8-φ26 | |
| 200 | 720 | 500 | 2 | 34 | 285 | 320 | 375 | 12-φ30 | |
design standards
Design and manufacturing: API623, GB/T12235
Connection size: ASME B16.5, HG/T20592, GB/T9124
Structure length: designed according to enterprise standards or designed according to customer requirements
Inspection and acceptance: API 598, GB/T 26480
structural characteristics
● The valve body flow channel is optimized and there is no "dead zone" to reduce medium residue;
● Adopt the structural design of the upper and lower valve stems. The rotation and lifting of the upper valve stem drives the lower valve stem to rise and fall linearly, which reduces the friction between the lower valve stem and the packing, reduces the wear of the packing, and prolongs the service life;
● The valve disc sealing surface and valve seat sealing surface are welded with cemented carbide to improve the wear and corrosion resistance of the sealing surface.
● For toxic, harmful and other dangerous media, you can choose a bellows discharge valve, which is safe and reliable with zero external leakage.
● For media that are easy to crystallize at room temperature, you can choose a thermal insulation discharge valve to effectively prevent the crystallization of the medium.
Main Parts & Materials
Valve body--A105/WCB/F304/CF8/F316L/CF3M
Disc--12Cr13/A105/F304/F316L
Stem--12Cr13/F304/F316L
Bellows--304/316L/HC276
Sealing surface-STL
Handwheel--WCB
Note: Assist customers in selecting specific materials based on their specific media
application scenarios
Fine chemicals, ethylene, polysilicon, biopharmaceuticals, lithium batteries, semiconductors, new energy, etc.
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